Back to EUR-Lex homepage

EUR-Lex Access to European Union law

Back to EUR-Lex homepage

This document is an excerpt from the EUR-Lex website

Use quotation marks to search for an "exact phrase". Append an asterisk (*) to a search term to find variations of it (transp*, 32019R*). Use a question mark (?) instead of a single character in your search term to find variations of it (ca?e finds case, cane, care).
Search tips
Need more search options? Use the Advanced search
You are here

Document 32014R0722R(01)

Corrigendum to Council Regulation (EU) No 722/2014 of 24 June 2014 amending Regulation (EU) No 1387/2013 suspending the autonomous Common Customs Tariff duties on certain agricultural and industrial products ( OJ L 192, 1.7.2014 )

OJ L 293, 9.10.2014, p. 58–58 (BG, ES, CS, DA, DE, ET, EL, EN, FR, HR, IT, LV, LT, HU, MT, NL, PL, PT, RO, SK, SL, FI, SV)

ELI: http://data.europa.eu/eli/reg/2014/722/corrigendum/2014-10-09/oj

9.10.2014   

EN

Official Journal of the European Union

L 293/58

Corrigendum to Council Regulation (EU) No 722/2014 of 24 June 2014 amending Regulation (EU) No 1387/2013 suspending the autonomous Common Customs Tariff duties on certain agricultural and industrial products

( Official Journal of the European Union L 192 of 1 July 2014 )

On page 29, Annex I, columns ‘CN code’/‘TARIC’, entry ‘ex 9014 10 00’/‘30’, column ‘Description’:

for:

‘Electronic compass, as a geomagnetic sensor, in a housing (e.g. CSWLP, LGA, SOIC) suitable for fully automated printed circuit board (PCB) assembly, with the following main components:

—

a combination of one or more application-specific integrated circuits (ASIC) and

—

one or more micro-electromechanical sensors (MEMS) manufactured with semiconductor technology, with mechanical components arranged in three-dimensional structures on the semiconductor material,

of a kind used in the manufacture of products falling in chapters 84-90 and 94 (1)’

,

read:

‘Electronic compass, as a geomagnetic sensor, in a housing (e.g. CSWLP, LGA, SOIC) suitable for fully automated printed circuit board (PCB) assembly, with the following main components:

—

a combination of one or more application-specific integrated circuits (ASIC), and

—

one or more micro-electromechanical sensors (MEMS) manufactured with semiconductor technology, with mechanical components arranged in three-dimensional structures on the semiconductor material,

of a kind used in the manufacture of products falling in chapters 84-90 and 94’

.
Top